Tokyo, Japan – A number of computer companies showed off their ability to produce “Superspeed” USB devices that work with each other.
This is the prelude to the introduction of USB 3.0 technologies which will probably result in products being available at the beginning of next year.
The conference – the Superspeed USB Developers Conference in Tokyo – used prototype software from Intel to show different devices working together.
Data transfer is slated to work 10 times faster than USB 2.0, and will also include better power management.
Demonstrations at the conference included a Fresco Logic prototype PC host working with a mass storage device from Fujitsu, while NEC performed a similar demonstration to a mass storage device from Lucidport.
Full details of the USB spec can be found here.